Patent Assignment
Reel/Frame 060923/0322
Assignment of Assignor's Interest
Recorded: 2022-08-29
Pages: 7
Assignors
TEYSSEYRE, JEROME
Executed: 2020-11-02
YOO, INPIL
Executed: 2020-11-20
EOM, JOOYANG
Executed: 2020-11-16
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Power Module Package for Direct Cooling Multiple Power Modules
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →