IP Library › Assignment 060673/0394
Patent Assignment
Reel/Frame 060673/0394

Assignment of Assignor's Interest

Recorded: 2022-07-29 Pages: 4
Assignors
LIN, YUSHENG
Executed: 2014-11-03
TAKAKUSAKI, SADAMICHI
Executed: 2014-11-04
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Substrate Structures and Methods of Manufacture
Application: 17/816,144 →
Publication: US 2022/0369468
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →
Security Interest Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →