Power module package with stacked direct bonded metal substrates
A package includes a first direct bonded metal (DBM) substrate, a first semiconductor die disposed on a top surface of the first DBM substrate, a second DBM substrate disposed at a height above the first DBM substrate, and a second semiconductor die disposed on a top surface of the second DBM substrate. A wire bond is made between the first semiconductor die disposed on the top surface of the first DBM substrate and the second semiconductor die disposed on the top surface of the second DBM substrate.
1 . A package comprising:
a first direct bonded metal (DBM) substrate;
a first semiconductor die disposed on a top surface of the first DBM substrate;
a second DBM substrate disposed above the first DBM substrate such that a section of the first semiconductor die is disposed between the first DBM substrate and the second DBM substrate, the second DBM substrate having a spacer layer formed along an edge and supporting the second DBM substrate above the first DBM substrate;
a second semiconductor die disposed on a top surface of the second DBM substrate; and
a wire bond between the first semiconductor die disposed on the top surface of the first DBM substrate and the second semiconductor die disposed on the top surface of the second DBM substrate.
2 . The package of claim 1 , wherein the section of the first semiconductor die disposed between the first DBM substrate is a first section, the first semiconductor die includes a second section not disposed underneath the second DBM substrate, and the wire bond is between the second section of the first semiconductor die disposed on the top surface of the first DBM substrate and the second semiconductor die disposed on the top surface of the second DBM substrate.
3 . The package of claim 1 , wherein the first DBM substrate and the first semiconductor die, the second DBM substrate and the second semiconductor die, and the wire bond between first semiconductor die and the second semiconductor die are encapsulated in a mold body.
4 . The package of claim 1 , wherein the second DBM substrate forms a shelf extending above a portion of the first semiconductor die and the first DBM substrate.
5 . The package of claim 4 , further comprising, a third semiconductor die disposed on a portion of the first DBM substrate that is not below the shelf formed by the second DBM substrate.
6 . The package of claim 1 , further comprising:
a first lead frame attached to a trace on the first DBM substrate; and
a second lead frame attached to a trace on the second DBM substrate.
7 . The package of claim 1 , wherein the first semiconductor die is an insulated-gate bipolar transistor (IGBT) die and the second semiconductor die is an integrated circuit (IC) controller die.
8 . A package comprising:
a stack of direct bonded metal (DBM) substrates including at least a first DBM substrate and a second DBM substrate disposed above the first DBM substrate;
a multiplicity of semiconductor die disposed on the stack of the DBM substrates including a first semiconductor die disposed on the first DBM substrate and a second semiconductor die disposed on the second DBM substrate, the second DBM substrate having a spacer layer formed along an edge and supporting the second DBM substrate above the first DBM substrate;
an insulating adhesive layer disposed between the first DBM substrate and the second DBM substrate and between the first semiconductor die and the second DBM substrate, a portion of first semiconductor die being encapsulated in the insulating adhesive layer; and
a wire bond between the first semiconductor die disposed on the first DBM substrate and the second semiconductor die disposed on the second DBM substrate.
9 . The package of claim 8 , further comprising:
a wire bond between the second semiconductor die disposed on the second DBM substrate and a trace on the second DBM substrate.
10 . The package of claim 8 , further comprising:
a first lead frame attached to a trace on the first DBM substrate; and
a second lead frame attached to a trace on the second DBM substrate.
11 . The package of claim 8 , further comprising:
a third semiconductor die disposed on the first DBM substrate; and
a wire bond between the first semiconductor die and the third semiconductor die disposed on the first DBM substrate.
12 . The package of claim 11 , further comprising:
a wire bond between the third semiconductor die disposed on the first DBM substrate and a lead frame of the package.
13 . The package of claim 11 , wherein the first semiconductor die, and third semiconductor die are power device dies, and the second semiconductor die is an integrated circuit (IC) controller die.
14 . A method comprising:
disposing a first device die on a top surface of a first direct bonded metal (DBM) substrate;
disposing a second DBM substrate above the first DBM substrate such that a first section of the first device die is disposed between the first DBM substrate and the second DBM substrate and a second section of the first device die is not disposed below the second DBM substrate, the second DBM substrate having a spacer layer formed along an edge and supporting the second DBM substrate above the first DBM substrate;
disposing a second device die on a top surface of the second DBM substrate disposed above the first DBM substrate; and
forming a wire bond between the first device die disposed on the top surface of the first DBM substrate and the second device die disposed on the top surface of the second DBM substrate.
15 . The method of claim 14 , wherein forming the spacer layer at the edge of the second DBM substrate includes forming a cavity in a bottom metal layer of the second DBM substrate by removing a portion of the bottom metal layer, and the first device die is located within the cavity.
16 . The method of claim 14 , further comprising:
encapsulating the first DBM substrate and the first device die, the second DBM substrate and the second device die, and the wire bond between first semiconductor die and the second device die in a mold body.
17 . The method of claim 14 , further comprising:
attaching a first leadframe to the first DBM substrate; and
attaching a second leadframe to the second DBM substrate.
18 . The method of claim 14 , wherein the second DBM substrate forms a ledge extending above a portion of the first device die and the first DBM substrate, and the method further comprises dispose a third device die on a portion of the first DBM substrate that is not below the ledge formed by the second DBM substrate.
19 . The method of claim 14 , wherein the first device die is an insulated-gate bipolar transistor (IGBT) die and the second device die is an integrated circuit (IC) controller die.