Dual side cooled power module with three-dimensional direct bonded metal substrates
A substrate includes a ceramic tile and a three-dimensional (3D) conductive structure. The 3D conductive structure includes a planar base layer having a bottom surface bonded to a top surface of the ceramic tile, and a block disposed above the planar base layer. The block is monolithically integrated with the planar base layer. A top surface of the block is configured as a die attach pad. The planar base layer has a base vertical thickness from the top surface of the ceramic tile to a top surface of the planar base layer. The block and the planar base layer have a combined vertical thickness from the top surface of the ceramic tile to a top surface of the block that is greater than the base vertical thickness.
1 . A substrate comprising:
a ceramic tile; and
a three-dimensional conductive structure including:
a planar base layer having a bottom surface bonded to a top surface of the ceramic tile, the planar base layer having a base vertical thickness from the top surface of the ceramic tile to a top surface of the planar base layer,
a block disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the block and the planar base layer having a first combined vertical thickness from the top surface of the ceramic tile to a top surface of the block, the first combined vertical thickness being greater than the base vertical thickness, the top surface of the block being configured as a die attach pad; and
a pillar disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the pillar and the planar base layer having a second combined vertical thickness from the top surface of the ceramic tile to a top surface of the pillar, the second combined vertical thickness being greater than the first combined vertical thickness.
2 . The substrate of claim 1 , wherein the block is a first block, the die attach pad being a first die attach pad, and
the three-dimensional conductive structure including:
a second block disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the second block being separated from the first block by a gap, the second block and the planar base layer having the first combined vertical thickness, a top surface of the second block being configured as a second die attach pad.
3 . The substrate of claim 1 , wherein the block is a first block and the die attach pad is a first die attach pad, the combined vertical thickness being a first combined vertical thickness, and wherein the three-dimensional conductive structure includes:
a second block disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the second block being separated from the first block by a gap, the second block and the planar base layer having a third combined vertical thickness different than the first combined vertical thickness, the top surface of the second block being configured as a second die attach pad.
4 . The substrate of claim 1 , wherein a portion of the top surface of block configured as a die attach pad includes a recessed cavity configured to hold a semiconductor die in position on the block.
5 . The substrate of claim 1 , wherein the vertical base thickness between the top surface of the ceramic tile and the top surface of the planar base layer is less than 0.4 mm.
6 . The substrate of claim 1 , wherein the first combined vertical thickness from the top surface of the ceramic tile to the top surface of the block is at least 0.6 mm.
7 . The substrate of claim 1 , wherein the block has a length and a width in a lateral plane, the length and the width each being greater than 0.2 mm long.
8 . The substrate of claim 1 , wherein the three-dimensional conductive structure is a metal or metal alloy structure bonded to the ceramic tile.
9 . The substrate of claim 1 , wherein the block is a first block that is separated from the pillar by a first gap, the three-dimensional conductive structure including:
a second block disposed above the planar base layer and integrated with the planar base layer without any intervening joint, the second block being separated from the pillar by a second gap, the first gap and second gap being on opposite sides of the pillar, the second block and the planar base layer having the first combined vertical thickness, a top surface of the second block being configured as a second die attach pad.
10 . A substrate comprising:
a ceramic tile; and
a three-dimensional conductive structure including:
a planar base layer having a bottom surface bonded to a top surface of the ceramic tile, the planar base layer having a vertical base thickness between the top surface of the ceramic tile and a top surface of the planar base layer,
a block disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the block having a vertical block thickness from the top surface of the planar base layer to a top surface of the block, the top surface of the block being configured as a die attach pad,
a pillar disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the pillar having a vertical pillar thickness from the top surface of the planar base layer to a top surface of the pillar, the vertical pillar thickness being greater than the vertical block thickness.
11 . The substrate of claim 10 , wherein the block is a first block and the die attach pad is a first die attach pad,
the three-dimensional conductive structure including:
a second block disposed above the planar base layer and integrated with the planar base layer without any intervening joint, the second block being separated from the first block by a gap, the second block and the planar base layer having a combined vertical thickness, the top surface of the second block being configured as a second die attach pad.
12 . The substrate of claim 10 , wherein the block is a first block, the die attach pad is a first die attach pad, and the vertical block thickness is a first vertical block thickness,
the three-dimensional conductive structure including:
a second block disposed above the planar base layer and integrated with the planar base layer without any intervening joint, the second block being separated from the first block by a gap, the second block and the planar base layer having a second vertical block thickness different than the first vertical block thickness, the top surface of the second block being configured as a second die attach pad.
13 . The substrate of claim 10 , wherein a portion of the top surface of block configured as a die attach pad includes a recessed cavity configured to hold a semiconductor die in position on the block.
14 . A package comprising:
a first direct bonded metal (DBM) substrate including:
a planar base layer having a bottom surface bonded to a top surface of a ceramic tile, the planar base layer having a vertical base thickness from the top surface of the ceramic tile to a top surface of the planar base layer,
a block disposed above the planar base layer and integrated with the planar base layer without any intervening joint, the block having a vertical block thickness from the top surface of the planar base layer to a top surface of the block, the top surface of the block being configured as a die attach pad, and
a pillar disposed above the planar base layer and integrated with the planar base layer without an intervening joint, the pillar having a vertical pillar thickness from the top surface of the planar base layer to a top surface of the pillar, the vertical pillar thickness being greater than the vertical block thickness;
a semiconductor die disposed on the die attach pad; and
a second DBM substrate disposed on a top of the semiconductor die.
15 . The package of claim 14 , wherein a portion of the top surface of block configured as the die attach pad includes a recessed cavity configured to hold a semiconductor die in position on the block.
16 . The package of claim 14 , wherein a first solder layer bonds the semiconductor die to the die attach pad.
17 . The package of claim 16 , wherein the first solder layer is a lead-free tin-antimony alloy.
18 . The package of claim 14 , wherein a second solder layer bonds the second substrate to the semiconductor die.
19 . The package of claim 18 , wherein the second solder layer is a lead-free tin-silver-copper alloy.
20 . The package of claim 14 , wherein a top surface of the pillar is bonded to the second DBM substrate disposed on the top of the semiconductor die.
21 . The package of claim 14 , wherein the block is a first block that is separated from the pillar by a first gap, the first DBM substrate including:
a second block disposed above the planar base layer and integrated with the planar base layer without any intervening joint, the second block being separated from the pillar by a second gap, the first gap and second gap being on opposite sides of the pillar, the second block and the planar base layer having the first combined vertical thickness, a top surface of the second block being configured as a second die attach pad.