Patent Assignment
Reel/Frame 060549/0219
Assignment of Assignor's Interest
Recorded: 2022-07-19
Pages: 6
Assignors
NOH, HYUNGGYUN
Executed: 2022-07-07
PAE, SANGWOO
Executed: 2022-07-07
BAE, JINSOO
Executed: 2022-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Module Including a Clip Structure