Patent Assignment
Reel/Frame 060556/0816
Assignment of Assignor's Interest
Recorded: 2022-06-30
Pages: 29
Assignors
TSUBOTA, YASUTOSHI
Executed: 2022-06-13
NAKAYAMA, MASANORI
Executed: 2022-06-19
FUNAKI, KATSUNORI
Executed: 2022-06-13
UEDA, TATSUSHI
Executed: 2022-06-13
TAKESHIMA, YUICHIRO
Executed: 2022-06-13
ICHIMURA, KEITA
Executed: 2022-06-15
IGAWA, HIROTO
Executed: 2022-06-15
YAMAKADO, YUKI
Executed: 2022-06-13
KISHIMOTO, HIROKI
Executed: 2022-06-13
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium