Patent Assignment
Reel/Frame 060556/0884
Assignment of Assignor's Interest
Recorded: 2022-06-30
Pages: 6
Assignors
KIM, MINKI
Executed: 2022-06-20
BAEK, SEUNGDUK
Executed: 2022-06-20
PARK, SOOJEOUNG
Executed: 2022-06-21
LEE, HYUEKJAE
Executed: 2022-06-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Bonding Interface