Patent Assignment
Reel/Frame 060557/0047
Assignment of Assignor's Interest
Recorded: 2022-07-20
Pages: 8
Assignors
ZHONG, ALBERT
Executed: 2020-04-08
TSAI, CHENG-YUAN
Executed: 2020-04-08
TRINH, HAI-DANG
Executed: 2020-04-08
PAN, SHING-CHYANG
Executed: 2020-07-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Diffusion Barrier Layer in Programmable Metallization Cell