Patent Assignment
Reel/Frame 060557/0831
Assignment of Assignor's Interest
Recorded: 2022-07-20
Pages: 9
Assignors
SU, HUAN-CHIEH
Executed: 2020-07-27
CHANG, CHIA-HAO
Executed: 2020-07-27
CHUANG, CHENG-CHI
Executed: 2020-07-27
WANG, CHIH-HAO
Executed: 2020-08-05
LIN, YU-MING
Executed: 2020-07-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Increasing Device Density and Reducing Cross-Talk Spacer Structures