Patent Assignment
Reel/Frame 060577/0137
Assignment of Assignor's Interest
Recorded: 2022-07-21
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2022-07-18
WEI, CHUN HUAN
Executed: 2022-07-21
LIN, MENG-LIANG
Executed: 2022-07-18
JENG, SHIN-PUU
Executed: 2022-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Integrated Passive Device Dies and Methods of Forming and Placement of the Same