Patent Assignment
Reel/Frame 060590/0430
Assignment of Assignor's Interest
Recorded: 2022-07-22
Pages: 5
Assignors
TIEN, HSI-WEN
Executed: 2022-06-30
CHU, HWEI-JAY
Executed: 2022-06-20
WU, CHIA-TIEN
Executed: 2022-06-20
WU, YUNG-HSU
Executed: 2022-07-07
LIAO, WEI-HAO
Executed: 2022-06-20
DAI, YU-TENG
Executed: 2022-07-07
YAO, HSIN-CHIEH
Executed: 2022-06-21
CHEN, HSIN-PING
Executed: 2022-06-20
LU, CHIH-WEI
Executed: 2022-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Including Interconnects with Lower Contact Resistance
Application:
17/825,741 →
Publication:
US 2023/0387022