Patent Assignment
Reel/Frame 060596/0735
Assignment of Assignor's Interest
Recorded: 2022-07-22
Pages: 4
Assignors
CHENG, CHUNG-LIANG
Executed: 2022-07-11
LI, SHENG-CHAN
Executed: 2022-07-11
CHEN, SHENG-CHAU
Executed: 2022-07-11
YU, CHUNG-YI
Executed: 2022-07-11
TSAI, CHENG-YUAN
Executed: 2022-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Isolation Structures and Methods of Forming the Same
Application:
17/814,347 →
Publication:
US 2024/0030258