Patent Assignment
Reel/Frame 060596/0948
Assignment of Assignor's Interest
Recorded: 2022-07-22
Pages: 4
Assignors
SUN, CHIH-HUNG
Executed: 2022-07-21
LIN, WEN-KAI
Executed: 2022-07-18
CHANG, CHE-HAO
Executed: 2022-07-17
WU, ZHEN-CHENG
Executed: 2022-07-17
CHUI, CHI ON
Executed: 2022-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Under Epitaxy Isolation Structure
Application:
17/871,403 →
Publication:
US 2023/0369428