Patent Assignment
Reel/Frame 060604/0807
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 10
Assignors
MALLIK, DEBENDRA
Executed: 2018-01-28
SANKMAN, ROBERT L.
Executed: 2018-01-29
NICKERSON, ROBERT
Executed: 2018-01-29
MODI, MITUL
Executed: 2018-01-29
GANESAN, SANKA
Executed: 2018-01-29
SWAMINATHAN, RAJASEKARAN
Executed: 2018-01-29
KARHADE, OMKAR
Executed: 2018-01-29
LIFF, SHAWNA M.
Executed: 2018-01-29
ALUR, AMRUTHAVALLI
Executed: 2018-02-15
CHAVALI, SRI CHAITRA J.
Executed: 2018-01-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Ultra-Thin, Hyper-Density Semiconductor Packages