Patent Assignment
Reel/Frame 060607/0507
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 4
Assignors
CHEN, CHIH-LIANG
Executed: 2022-07-10
ZHUANG, HUI-ZHONG
Executed: 2022-06-23
CHIU, SHANG-HSUAN
Executed: 2022-06-23
LU, CHI-YU
Executed: 2022-06-23
KAO, JERRY CHANG JUI
Executed: 2022-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Metal Layer Structure Over Cell Region