Patent Assignment
Reel/Frame 060607/0774
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 4
Assignors
LEE, MEI-CHI
Executed: 2022-05-31
CHEN, CHI-CHENG
Executed: 2022-06-03
HUANG, WEI-LI
Executed: 2022-06-04
TZENG, KAI
Executed: 2022-06-17
WU, CHUN YI
Executed: 2022-07-22
CHENG, MING-DA
Executed: 2022-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Inductive Component and Method of Forming