Patent Assignment
Reel/Frame 060609/0239
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 5
Assignors
SON, YOONHWAN
Executed: 2022-06-30
SHIN, MINSOO
Executed: 2022-06-30
SHIN, JOONGSHIK
Executed: 2022-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device and Electronic System Including Vertical Structures and Seed Layer