Patent Assignment
Reel/Frame 060609/0346
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 14
Assignors
KIM, SEUNGHWAN
Executed: 2022-07-05
KOH, KYONGHWAN
Executed: 2022-07-04
KIM, JUNGJOO
Executed: 2022-07-05
KIM, JONGWAN
Executed: 2022-07-05
PARK, JUNWOO
Executed: 2022-07-05
BAEK, HYUNGGIL
Executed: 2022-07-05
LEE, YONGKWAN
Executed: 2022-07-05
JANG, DONGJU
Executed: 2022-07-05
JEON, TAEJUN
Executed: 2022-07-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Molded Product for Semiconductor Strip and Method of Manufacturing Semiconductor Package