Patent Assignment
Reel/Frame 060615/0059
Assignment of Assignor's Interest
Recorded: 2022-07-25
Pages: 6
Assignors
PARK, JUNG HO
Executed: 2022-04-25
KANG, GYU HO
Executed: 2022-04-25
BAE, SEONG-HOON
Executed: 2022-04-25
JIN, JEONG GI
Executed: 2022-04-25
CHOI, JU-IL
Executed: 2022-04-25
FUJISAKI, ATSUSHI
Executed: 2022-07-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same
Application:
17/814,828 →
Publication:
US 2023/0026211
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.