Patent Assignment
Reel/Frame 060615/0585
Assignment of Assignor's Interest
Recorded: 2022-07-26
Pages: 4
Assignors
KUO, TING-TING
Executed: 2022-07-25
HUANG, LI-HSIEN
Executed: 2022-07-25
YANG, TIEN-CHUNG
Executed: 2022-07-25
CHUANG, YAO-CHUN
Executed: 2022-07-25
LU, YINLUNG
Executed: 2022-07-25
HE, JUN
Executed: 2022-07-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fan-Out Package Structures with Cascaded Openings in Enhancement Layer