Patent Assignment
Reel/Frame 060617/0289
Assignment of Assignor's Interest
Recorded: 2022-07-08
Pages: 5
Assignors
PARK, JEONGWON
Executed: 2021-11-11
KIM, CHULKWI
Executed: 2021-11-11
YOO, YOUNSANG
Executed: 2021-11-11
YOON, JONGMIN
Executed: 2021-11-11
PARK, CHANMIN
Executed: 2021-11-11
YEOM, DONGHYUN
Executed: 2021-11-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Having Cooling Module and Method for Contorlling Cooling Module Thereof