Patent Assignment
Reel/Frame 060622/0514
Assignment of Assignor's Interest
Recorded: 2022-07-26
Pages: 4
Assignors
HSUEH, HSIU-WEN
Executed: 2020-03-11
YANG, JIING-FENG
Executed: 2020-03-11
CHEN, CHII-PING
Executed: 2020-03-11
HUANG, PO-HSIANG
Executed: 2020-03-11
CHEN, CHANG-WEN
Executed: 2020-03-11
WU, CAI-LING
Executed: 2022-03-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Inter-Wire Cavity for Low Capacitance