Patent Assignment
Reel/Frame 060642/0161
Nunc Pro Tunc Assignment
Recorded: 2022-07-27
Pages: 3
Assignor
SHEN, YUCI
Executed: 2021-11-16
Assignee
IC CHIP COOLING TECHNOLOGIES LLC
1401 21ST STREET SUITE 8218, ATTN: YUCI SHEN, SACRAMENTO, CALIFORNIA, 95811
Covered Properties
(2)
Heat-Dissipating Lid with Reservoir Structure and Associated Lidded Flip Chip Package Allowing for Liquid Thermal Interfacing Materials
Patent:
10,643,924 →
Application:
16/400,666 →
Reservoir Structure and System Forming Gap for Liquid Thermal Interface Material