Patent Assignment
Reel/Frame 060644/0541
Assignment of Assignor's Interest
Recorded: 2022-07-27
Pages: 4
Assignors
HUANG, LIN-YU
Executed: 2020-07-24
YU, LI-ZHEN
Executed: 2020-07-24
CHANG, CHIA-HAO
Executed: 2020-07-24
CHUANG, CHENG-CHI
Executed: 2020-07-24
CHENG, KUAN-LUN
Executed: 2020-07-27
WANG, CHIH-HAO
Executed: 2020-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same