Patent Assignment
Reel/Frame 060645/0579
Assignment of Assignor's Interest
Recorded: 2022-07-27
Pages: 6
Assignors
LEE, EUNGCHANG
Executed: 2022-05-18
LEE, BANGWEON
Executed: 2022-05-18
KIM, JAE CHOON
Executed: 2022-05-18
OH, KYUNG SUK
Executed: 2022-05-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package