Patent Assignment
Reel/Frame 060653/0166
Assignment of Assignor's Interest
Recorded: 2022-07-28
Pages: 9
Assignors
CHANG, CHENG-WEI
Executed: 2020-04-16
WANG, SUNG-LI
Executed: 2020-04-15
LIU, YI-YING
Executed: 2020-04-14
CHU, CHIA-HUNG
Executed: 2020-04-15
LEE, FANG-WEI
Executed: 2020-04-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Middle-Of-Line Interconnect Structure and Manufacturing Method