Patent Assignment
Reel/Frame 060655/0229
Assignment of Assignor's Interest
Recorded: 2022-07-28
Pages: 4
Assignors
HSIEH, PING-YIN
Executed: 2022-07-20
CHEN, CHIH-HAO
Executed: 2022-07-20
LIAO, YI-HUAN
Executed: 2022-07-24
WANG, PU
Executed: 2022-07-20
CHENG, LI-HUI
Executed: 2022-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same
Application:
17/815,629 →
Publication:
US 2024/0038623