Patent Assignment
Reel/Frame 060657/0122
Assignment of Assignor's Interest
Recorded: 2022-07-28
Pages: 2
Assignors
CHEN, YU-JEN
Executed: 2018-04-03
WANG, LING-SUNG
Executed: 2018-04-03
HUANG, I-SHAN
Executed: 2018-04-30
HUNG, CHAN-YU
Executed: 2018-04-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSING RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Making Semiconductor Device and Semiconductor Device