Patent Assignment
Reel/Frame 060662/0390
Assignment of Assignor's Interest
Recorded: 2022-07-28
Pages: 10
Assignors
CHOI, HAE WON
Executed: 2022-07-08
SHIN, SEUNG MIN
Executed: 2022-07-19
PARK, SANG JINE
Executed: 2022-07-18
SHIN, JAE WON
Executed: 2022-07-08
PARK, JI HWAN
Executed: 2022-07-18
LEE, KUN TACK
Executed: 2022-07-22
ANTON, KORIAKIN
Executed: 2022-07-08
WON, JOON HO
Executed: 2022-07-08
HEO, PIL KYUN
Executed: 2022-07-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus and Method Thereof