Patent Assignment
Reel/Frame 060664/0742
Assignment of Assignor's Interest
Recorded: 2022-07-29
Pages: 6
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
50, YONSEI-RO, SEODAEMUN-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Through-Silicon via (Tsv) Test Device and Operating Method Thereof
Application:
17/875,889 →
Publication:
US 2023/0070785