Patent Assignment
Reel/Frame 060666/0530
Assignment of Assignor's Interest
Recorded: 2022-07-29
Pages: 5
Assignors
CHANG, PANG-SHENG
Executed: 2020-06-17
WANG, CHAO-HSUN
Executed: 2020-06-17
CHAO, KUO-YI
Executed: 2020-06-17
YANG, FU-KAI
Executed: 2020-06-17
WANG, MEI-YUN
Executed: 2020-06-17
WU, LI-CHIEH
Executed: 2020-06-17
HSU, CHUN-WEI
Executed: 2020-06-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Polishing Interconnect Structures In Semiconductor Devices