Patent Assignment
Reel/Frame 060669/0198
Assignment of Assignor's Interest
Recorded: 2022-07-29
Pages: 4
Assignors
LIN, JIAN-HONG
Executed: 2021-11-01
HSIEH, MING-HONG
Executed: 2021-11-01
CHANG, HSIN-CHUN
Executed: 2021-11-01
WANG, MING-YIH
Executed: 2021-11-01
LU, YINLUNG
Executed: 2021-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU CITY, 300-78, TAIWAN
Covered Property
(1)
Through-Circuit Vias In Interconnect Structures