IP Library › Assignment 060669/0753
Patent Assignment
Reel/Frame 060669/0753

Assignment of Assignor's Interest

Recorded: 2022-07-29 Pages: 4
Assignors
SON, YOUNGHWAN
Executed: 2022-07-07
LEE, DONGKEUN
Executed: 2022-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Three-Dimensional Semiconductor Memory Device, Method of Fabricating the Same, and Electronic System Including the Same
Application: 17/876,877 →
Publication: US 2023/0200072