Patent Assignment
Reel/Frame 060672/0978
Assignment of Assignor's Interest
Recorded: 2022-07-29
Pages: 8
Assignors
KIM, TAE KI
Executed: 2019-08-07
KIM, JAE BEOM
Executed: 2019-08-07
SON, SEUNG NAM
Executed: 2019-08-07
DO, WON CHUL
Executed: 2019-08-07
Assignee
AMKOR TECHNOLOGY KOREA, INC.
100, AMKOR-RO, BUK-GU, GWANGJU, 61006, KOREA, REPUBLIC OF
Covered Property
(1)
Device Chip Scale Package Including a Protective Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.