Patent Assignment
Reel/Frame 060678/0300
Assignment of Assignor's Interest
Recorded: 2022-07-30
Pages: 4
Assignors
PAN, YU-CHI
Executed: 2022-05-29
LIN, KUAN-WEI
Executed: 2022-07-10
LIN, CHUN-NENG
Executed: 2022-07-10
WANG, YU-SHIH
Executed: 2022-07-11
YEH, MING-HSI
Executed: 2022-07-17
HUANG, KUO-BIN
Executed: 2022-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Device with Modified Work Function Layer and Method of Forming the Same
Application:
17/849,154 →
Publication:
US 2023/0420538