Patent Assignment
Reel/Frame 060697/0227
Assignment of Assignor's Interest
Recorded: 2022-08-02
Pages: 8
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method