Patent Assignment
Reel/Frame 060703/0087
Assignment of Assignor's Interest
Recorded: 2022-08-03
Pages: 4
Assignors
JUANG, JING-YE
Executed: 2022-07-09
CHEN, HSIEN-WEI
Executed: 2022-05-31
JENG, SHIN-PUU
Executed: 2022-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structures Including Glass Core Layer and Methods of Forming the Same