IP Library › Assignment 060712/0257
Patent Assignment
Reel/Frame 060712/0257

Assignment of Assignor's Interest

Recorded: 2022-08-03 Pages: 3
Assignors
CHEN, KUEI-MING
Executed: 2022-05-12
CHEN, CHI-MING
Executed: 2022-06-13
CHANG, SHIH-PANG
Executed: 2022-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Structures With Improved Reliability
Application: 17/831,714 →
Publication: US 2023/0395531
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 11, 2024
From: CHEN, KUEI-MING; CHEN, CHI-MING; CHANG, SHIH-PANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 066103/0193 →