Patent Assignment
Reel/Frame 060714/0522
Assignment of Assignor's Interest
Recorded: 2022-08-04
Pages: 4
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Molding Management Apparatus