Patent Assignment
Reel/Frame 060724/0852
Assignment of Assignor's Interest
Recorded: 2022-08-04
Pages: 3
Assignors
CHEN, LI-HUI
Executed: 2022-07-28
CHEN, CHUN-HUNG
Executed: 2022-07-27
LIAW, JHON JHY
Executed: 2022-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
17/880,341 →
Publication:
US 2024/0047560