IP Library › Assignment 060726/0564
Patent Assignment
Reel/Frame 060726/0564

Assignment of Assignor's Interest

Recorded: 2022-08-05 Pages: 4
Assignors
NAKATANI, MASAFUMI
Executed: 2022-08-03
HIRAGA, KIMIHISA
Executed: 2022-08-03
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property (1)
Temperature Compensation Circuit and Semiconductor Integrated Circuit Using the Same
Application: 17/881,639 →
Publication: US 2023/0084920