Patent Assignment
Reel/Frame 060733/0214
Assignment of Assignor's Interest
Recorded: 2022-08-05
Pages: 3
Assignee
GLOBALWAFERS JAPAN CO., LTD.
6-861-5, HIGASHIKO, SEIRO-MACHI, KITAKANBARA-GUN, NIIGATA, 9570197, JAPAN
Covered Property
(1)
Manufacturing Method for Semiconductor Silicon Wafer