Patent Assignment
Reel/Frame 060739/0286
Assignment of Assignor's Interest
Recorded: 2022-08-07
Pages: 4
Assignors
LAI, PO-CHEN
Executed: 2022-05-15
YEW, MING-CHIH
Executed: 2022-05-13
YEH, SHU-SHEN
Executed: 2022-08-01
LIN, PO-YAO
Executed: 2022-05-15
JENG, SHIN-PUU
Executed: 2022-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Chip Package having Underfill Material Surrounding a Fan-Out Package and Contacting a Stress Buffer Structure Sidewall