Patent Assignment
Reel/Frame 060740/0018
Assignment of Assignor's Interest
Recorded: 2022-08-08
Pages: 4
Assignors
WANG, CHIN-HUA
Executed: 2022-05-12
YEH, SHU-SHEN
Executed: 2022-08-08
HSU, CHIA-KUEI
Executed: 2022-05-02
LIN, PO-YAO
Executed: 2022-05-05
JENG, SHIN-PUU
Executed: 2022-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Reinforced Substrates to Mitigate Underflow Stress and Package Warp and Methods of Making the Same
Application:
17/750,429 →
Publication:
US 2023/0378042