Patent Assignment
Reel/Frame 060751/0200
Assignment of Assignor's Interest
Recorded: 2022-08-09
Pages: 12
Assignors
WU, WEI CHUANG
Executed: 2018-01-24
WANG, CHING-CHUN
Executed: 2018-01-24
YAUNG, DUN-NIAN
Executed: 2018-01-24
HUNG, FENG-CHI
Executed: 2018-01-24
LIU, JEN-CHENG
Executed: 2018-01-24
CHIANG, YEN-TING
Executed: 2018-01-24
CHEN, CHUN-YUAN
Executed: 2018-01-24
HONG, SHEN-HUI
Executed: 2018-01-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multiple Deep Trench Isolation (Mdti) Structure for Cmos Image Sensor