Patent Assignment
Reel/Frame 060755/0476
Assignment of Assignor's Interest
Recorded: 2022-08-09
Pages: 4
Assignors
HSU, TING-CHEN
Executed: 2022-07-14
CHENG, HSIN-LI
Executed: 2022-07-14
LIN, JYUN-YING
Executed: 2022-07-11
TSUI, YINGKIT FELIX
Executed: 2022-07-11
SU, SHU-HUI
Executed: 2022-07-11
WU, SHI-MIN
Executed: 2022-07-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Trench Capacitor Film Scheme to Reduce Substrate Warpage