IP Library Assignment 060764/0970
Patent Assignment
Reel/Frame 060764/0970

Assignment of Assignor's Interest

Recorded: 2022-08-10 Pages: 3
Assignors
VINCENT, MICHAEL B.
Executed: 2022-08-08
MATHEW, VARUGHESE
Executed: 2022-08-08
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Package with Mold-Embedded Inductor and Method of Fabrication Therefor
Application: 17/818,728 →
Publication: US 2024/0055415