Patent Assignment
Reel/Frame 060776/0680
Assignment of Assignor's Interest
Recorded: 2022-08-11
Pages: 3
Assignors
LIU, TZUAN-HORNG
Executed: 2022-07-31
TSAI, HAO-YI
Executed: 2022-07-31
CHUANG, KRIS LIPU
Executed: 2022-08-01
PAN, HSIN-YU
Executed: 2022-07-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof