IP Library Assignment 060778/0255
Patent Assignment
Reel/Frame 060778/0255

Change of Name

Recorded: 2022-07-20 Pages: 5
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Application: 17/867,554 →
Publication: US 2022/0375891
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 20, 2022
From: SATO, HIROAKI; KANG, TECK-GYU; HABA, BELGACEM; OSBORN, PHILIP R.
To: TESSERA, INC.
Reel/Frame 060570/0645 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →