Patent Assignment
Reel/Frame 060782/0179
Assignment of Assignor's Interest
Recorded: 2022-08-11
Pages: 3
Assignors
LEE, HSIN-YI
Executed: 2020-09-15
WANG, KUAN-YU
Executed: 2020-09-15
HUNG, CHENG-LUNG
Executed: 2020-09-15
CHUI, CHI-ON
Executed: 2020-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Forming Method Thereof